Title :
Evaluation of drop impact load for portable electronic components
Author :
Omori, Takahiro ; Inoue, Hirotsugu ; Kawamura, Noriyasu ; Mukai, Minoru ; Kishimoto, Kikuo ; Kawakami, Takashi
Author_Institution :
Corporate R&D Center, Toshiba Corp., Kawasaki, Japan
Abstract :
A method to predict impact load caused by the collision of two rods is investigated in this paper. To obtain normal impact load, Hertzian law is applied to express the contact compliance. Frictional force and deformation of two bodies are also taken into account. Some drop impact tests and simulations are performed with several heights and positions to verify the modeling. The results of comparing analysis with experiment show that frictional force and deformation of two rods greatly affect the impact load. It is noted that the finite element method can also predict the impact load and that slipping and sticking between two rods during impact are likely to affect the impact load.
Keywords :
deformation; electronic products; finite element analysis; friction; impact testing; Hertzian law; contact compliance; drop impact load; drop impact tests; finite element method; frictional force; normal impact load; portable electronic components; rod deformation; Acceleration; Deformable models; Electronic components; Finite element methods; Liquid crystal displays; Motion analysis; Steel; Strain measurement; Testing; Transient analysis;
Conference_Titel :
Electronics Materials and Packaging, 2005. EMAP 2005. International Symposium on
Print_ISBN :
1-4244-0107-0
DOI :
10.1109/EMAP.2005.1598273