A study in establishing flip-chip ball grid array (FCBGA) second level interconnect (SLI) reliability requirement by CFD simulation

Author

Kwong, Lee Eng ; Aun, Tan Wooi

Author_Institution

Intel Technol., Penang, Malaysia

fYear

2005

fDate

11-14 Dec. 2005

Firstpage

292

Lastpage

295

Abstract

CFD simulation using commercial tool such as Flotherm has been carried out to analyze the solder ball temperature (Tsb) in different regions underneath a FCBGA package in order to establish and characterize the second level interconnect (SLI) reliability requirement of the package. The package details and the mechanical load on the package directly affect Tsb and the thermal fatigue locus. The Tsb is used to correlate with the modified Coffin-Manson model in order to assess the package SLI solder joint reliability performance under temperature cycling stress.

Keywords

ball grid arrays; computational fluid dynamics; flip-chip devices; interconnections; reliability; solders; thermal stress cracking; CFD simulation; FCBGA package; flip-chip ball grid array; mechanical load; modified Coffin-Manson model; second level interconnect reliability; solder ball temperature; solder joint reliability; temperature cycling stress; thermal fatigue locus; Computational fluid dynamics; Cooling; Electronics packaging; Fatigue; Heat sinks; Semiconductor device packaging; Silicon; Soldering; Temperature; Thermal management;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Materials and Packaging, 2005. EMAP 2005. International Symposium on

Print_ISBN

1-4244-0107-0

Type

conf

DOI

10.1109/EMAP.2005.1598278

Filename

1598278