AHDL based thermal-analog simulation for microsystems

Author

Niculiu, T. ; Manolescu, Andrei ; Manolescu, Andrei ; Glesner, Manfred

Author_Institution

Fac. de Electron. si Telecomunicatii, Univ. Politechnica Bucuresti, Romania

Volume

1

fYear

1998

fDate

6-10 Oct 1998

Firstpage

79

Abstract

The development of CAD procedures for microsystems requires simulation of thermal phenomena, as secondary effects beside the main analog functions-electronic mechanical, optical, chemical. We use an Analog Hardware Description Language, extending the models for microsystem components to include temperature dependence and power generation estimation. We concentrate on heat conduction. The partial differential equations are spatially discretized or replaced by direct simulation of microscopic heat conduction

Keywords

analogue simulation; hardware description languages; heat conduction; micromechanical devices; AHDL; Analog Hardware Description Language; CAD; heat conduction; microsystem; partial differential equation; power generation; spatial discretization; temperature dependence; thermal-analog simulation; Biomedical optical imaging; Boundary conditions; Circuit simulation; Context modeling; Data structures; Differential equations; Heat transfer; Liquids; Mathematical model; Microscopy;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Conference, 1998. CAS '98 Proceedings. 1998 International

Conference_Location

Sinaia

Print_ISBN

0-7803-4432-4

Type

conf

DOI

10.1109/SMICND.1998.732284

Filename

732284