Title :
A canary device based approach for prognosis of Ball Grid Array packages
Author :
Mathew, Sony ; Osterman, Michael ; Pecht, Michael
Author_Institution :
Center for Adv. Life Cycle Eng. (CALCE), Univ. of Maryland, College Park, MD, USA
Abstract :
In recent years prognostics and health management has become the preferred approach to achieve advance warning of and respond to impending failure of systems. One approach for conducting prognosis is to use a canary device which fails by the same failure mechanism as would the actual product. The canary device is designed to fail before the actual product. This paper presents a novel method of using solder interconnection as a canary. The application of the approach for prognosis of Ball Grid Array packages is also presented herein.
Keywords :
ball grid arrays; failure analysis; interconnections; solders; Canary device based approach; PHM approach; ball grid array package prognosis; failure mechanism; prognostic and health management approach; solder interconnection; Failure analysis; Fatigue; Loading; Prognostics and health management; Reliability; Resistors; Soldering; BGA; Canary Device; Fatigue Failure; Physics of Failure; Solder Joint;
Conference_Titel :
Prognostics and Health Management (PHM), 2012 IEEE Conference on
Conference_Location :
Denver, CO
Print_ISBN :
978-1-4673-0356-9
DOI :
10.1109/ICPHM.2012.6299546
