DocumentCode
3311852
Title
Wrapped phase based SVM method for 3D object recognition
Author
Zhang, Hong ; Su, Hongjun
Author_Institution
Dept. of Comput. Sci., Armstrong Atlantic State Univ., Savannah, GA, USA
fYear
2009
fDate
8-11 Aug. 2009
Firstpage
206
Lastpage
209
Abstract
Kernel methods are effective machine learning techniques for many image based pattern recognition problems. Incorporating 3D information is useful in such applications. The optical profilometries and interforometric techniques provide 3D information in an implicit form. Typically phase unwrapping process, which is often hindered by the presence of noises, spots of low intensity modulation, and instability of the solutions, is applied to retrieve the proper depth information. In certain applications such as pattern recognition problems, the goal is to classify the 3D objects in the image, rather than to simply display or reconstruct them. In this paper we present a technique for constructing kernels on the measured data directly without explicit phase unwrapping. Such a kernel will naturally incorporate the 3D depth information and can be used to improve the systems involving 3D object analysis and classification. It avoids possible phase unwrapping errors introduced during object reconstruction.
Keywords
image classification; image reconstruction; image retrieval; learning (artificial intelligence); object recognition; support vector machines; 3D object recognition; image classification; image reconstruction; information retrieval; intensity modulation; interforometric technique; kernel method; machine learning technique; optical profilometry; pattern recognition; wrapped phase based SVM method; Image reconstruction; Intensity modulation; Kernel; Machine learning; Object recognition; Optical modulation; Optical noise; Pattern recognition; Phase noise; Support vector machines; 3D Object Recongnition; Kernal Construction; Phase Uunwrapping; SVM;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer Science and Information Technology, 2009. ICCSIT 2009. 2nd IEEE International Conference on
Conference_Location
Beijing
Print_ISBN
978-1-4244-4519-6
Electronic_ISBN
978-1-4244-4520-2
Type
conf
DOI
10.1109/ICCSIT.2009.5234564
Filename
5234564
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