DocumentCode :
3312136
Title :
1200V IGBTs operating at 200°C? An investigation on the potentials and the design constraints
Author :
Schlapbach, U. ; Rahimo, M. ; von Arx, C. ; Mukhitdinov, A. ; Linder, S.
Author_Institution :
ABB Switzerland Ltd, Lenzburg
fYear :
2007
fDate :
27-31 May 2007
Firstpage :
9
Lastpage :
12
Abstract :
The targeted 175degC junction temperature limit for the next generation of 1200 V IGBT requires safe and reliable operation of the devices at a temperature of 200degC. Due to the exponential scaling of several IGBT parameters, such high temperatures will subject the IGBT to new levels of stress, guiding chip designers and application people onto completely new grounds whose firmness is largely unknown. In this paper, we take some first steps by investigating the operation of 1200 V IGBTs at temperatures up to 200degC, looking at their characteristics, trying to understand potentials and possible threats, and drawing initial conclusions how such devices must be dimensioned in order to operate safely.
Keywords :
insulated gate bipolar transistors; integrated circuit design; IGBT; chip design; power handling capability; power semiconductors; temperature 200 degC; voltage 1200 V; Cooling; Insulated gate bipolar transistors; Leakage current; Performance loss; Power semiconductor devices; Semiconductor device reliability; Stability criteria; Stress; Temperature distribution; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Semiconductor Devices and IC's, 2007. ISPSD '07. 19th International Symposium on
Conference_Location :
Jeju Island
Print_ISBN :
1-4244-1095-9
Electronic_ISBN :
1-4244-1096-7
Type :
conf
DOI :
10.1109/ISPSD.2007.4294919
Filename :
4294919
Link To Document :
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