1.3 μm low cost plastic module for 622 Mbit/s transmission at 85°C

Author

Fernier, B. ; Adam, K. ; Artigue, C. ; Barrou, Th. ; Göth, A. ; Grard, E. ; Jörg, W. ; Keller, D. ; Lafragette, J.L. ; Lestra, A. ; Pagnod, Ph. ; Rabaron, S. ; Rainsant, J.M. ; Scherb, J. ; Toullier, D. ; Trégoat, D. ; Rehm, W.

Author_Institution

Groupement d´´Interet Econ., OPTO+, Marcoussis, France

Volume

1

fYear

1998

fDate

20-24 Sep 1998

Firstpage

445

Abstract

We present the characteristics of an uncooled plastic module for outdoor operation (+3 dBm at 85°C). A transmission experiment is reported at 622 Mbit/s and up to 85°C temperature. We describe the module design, then we discuss the performance of the optoelectronic (OE) chips. Finally, the static and dynamic performance of the intermediate sub-assembly and of the whole 1.3 μm CW plastic module are reported

Keywords

integrated optics; integrated optoelectronics; modules; optical communication equipment; plastics; quantum well lasers; 1.3 μm low cost plastic module; 622 Mbit/s; 85 C; CW plastic module; Mbit/s transmission; dynamic performance; intermediate sub-assembly; module design; optoelectronic chip performance; outdoor operation; static performance; transmission experiment; uncooled plastic module; Bit error rate; Connectors; Costs; Current measurement; Fiber lasers; Monitoring; Optical coupling; Plastics; Power generation; Power measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Optical Communication, 1998. 24th European Conference on

Conference_Location

Madrid

Print_ISBN

84-89900-14-0

Type

conf

DOI

10.1109/ECOC.1998.732648

Filename

732648