DocumentCode :
3313460
Title :
High temperature behaviour of 3.5 kV 4H-SiC JBS diodes
Author :
Brosselard, P. ; Jorda, Xavier ; Vellvehi, Miquel ; Godignon, P. ; Bergman, J.P. ; Lambert, B.
Author_Institution :
Campus UAB, Barcelona
fYear :
2007
fDate :
27-31 May 2007
Firstpage :
285
Lastpage :
288
Abstract :
4H-SiC JBS diodes have been manufactured on a Norstel epitaxied N/N+ substrate using a JTE as edge termination. A breakdown voltage higher than 3.5 kV has been measured on 0.16 and 2.56 mm2 diodes. The leakage current in the 25degC-300degC temperature range depends on the bipolar/Schottky ratio whereas in forward mode its impact is minor. Diodes have been stressed in DC mode to show that the 2.56 mm2 diodes have a slight forward voltage degradation independently of the layout. In switching mode, the recovery charge is only 20 nC for a 4A current switched at 300degC.
Keywords :
Schottky diodes; power bipolar transistors; silicon compounds; wide band gap semiconductors; 4H-SiC JBS diodes; JTE; SiC; SiC - Interface; bipolar-Schottky ratio; edge termination; forward voltage degradation; high temperature diode behaviour; temperature 25 degC to 300 degC; voltage 3.5 kV; Anodes; Leakage current; Manufacturing; Power semiconductor switches; Schottky diodes; Semiconductor diodes; Substrates; Temperature distribution; Voltage; Wide band gap semiconductors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Semiconductor Devices and IC's, 2007. ISPSD '07. 19th International Symposium on
Conference_Location :
Jeju Island
Print_ISBN :
1-4244-1095-9
Electronic_ISBN :
1-4244-1096-7
Type :
conf
DOI :
10.1109/ISPSD.2007.4294988
Filename :
4294988
Link To Document :
بازگشت