Title :
Temperature analysis of thermoelectric device of Cu4SnS4 with two dimension by boundary element method
Author :
Kondo, S. ; Hasaka, M. ; Morimura, T.
Author_Institution :
Dept. of Mater. Sci. & Eng., Nagasaki Univ., Japan
Abstract :
Temperature distribution of a thermoelectric device composed of Cu/sub 4/SnS/sub 4/ compound in two-dimension is evaluated by the boundary element method (BEM). It is found that temperature distribution is strongly dependent on the length of the thermoelectric device. Temperature distribution shows very strong dependence of the direction of length of device when the length of device is very thin. In the case of small electric current density such as -1 A/cm/sup 2/, temperature distribution can be approximately expressed as the solution of Laplace equation.
Keywords :
Laplace equations; boundary-elements methods; copper compounds; current density; temperature distribution; thermoelectric devices; tin compounds; Cu/sub 4/SnS/sub 4/; Laplace equation; boundary element method; small electric current density; temperature distribution; thermoelectric device; two-dimensions; Conductivity measurement; Electric resistance; Electric variables measurement; Electrical resistance measurement; Force measurement; Length measurement; Temperature dependence; Temperature distribution; Thermal conductivity; Thermoelectric devices;
Conference_Titel :
Thermoelectrics, 1996., Fifteenth International Conference on
Conference_Location :
Pasadena, CA, USA
Print_ISBN :
0-7803-3221-0
DOI :
10.1109/ICT.1996.553307
