• DocumentCode
    3313866
  • Title

    Study of space charge dynamics directly on power cables using the thermal step method

  • Author

    Agnel, S. ; Notingher, P., Jr. ; Toureille, A. ; Castellon, J. ; Malrieu, S.

  • Author_Institution
    Lab. d´´Electrotech., Univ. des Sci. et Tech. du Languedoc, Montpellier, France
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    50
  • Abstract
    In recent years, many studies concerned with space charge have been performed on slabs and films made of materials for power cables. The structure of a cable and the distributions of the electrical and thermal stresses in the cable are different from a plaque-type sample. The thermal step method for space charge measurements (TSM) is directly applicable both to plaque-type samples and to insulating components of various geometries, with thicknesses up to 20 mm (cables, electrical machines windings, circuit boards, capacitor films). This work presents applications of the TSM to power cables. By using two different techniques of applying the thermal step (outer cooling and inner heating), we study the appearance and the evolution of the space charge within cable insulation as well as the effect of the manufacturing process on the radial and angular symmetry of a high voltage cable
  • Keywords
    power cable insulation; space charge; thermal stability; thermal stresses; angular symmetry; cable insulation; capacitor films; circuit boards; electrical machines windings; electrical stresses; films; high voltage cable; power cables; slabs; space charge dynamics; space charge measurements; thermal step method; thermal stresses; Cable insulation; Charge measurement; Current measurement; Dielectrics and electrical insulation; Electric variables measurement; Power cables; Slabs; Space charge; Thermal stresses; Thickness measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena, 1999 Annual Report Conference on
  • Conference_Location
    Austin, TX
  • Print_ISBN
    0-7803-5414-1
  • Type

    conf

  • DOI
    10.1109/CEIDP.1999.804590
  • Filename
    804590