DocumentCode
3314825
Title
CFD thermal analysis of a telecommunication board
Author
Abakr, Y.A. ; Ahmed, M.I. ; Ismail, A.F.
Author_Institution
Fac. of Eng., HUM, Kuala Lumpur, Malaysia
fYear
2003
fDate
14-15 Jan. 2003
Firstpage
181
Lastpage
184
Abstract
A telecommunications electronic circuit board´s cooling requirements are studied using CFD (computational fluid dynamics). A mathematical model is developed in order to simulate thermal performance, including radiation, conduction and convection heat transfer. A steady state simulation was carried out using Fluent CFD software and the results were compared with full-sized experimental measurements, which were conducted previously.
Keywords
computational fluid dynamics; convection; digital simulation; heat conduction; heat radiation; telecommunication equipment testing; thermal analysis; CFD thermal analysis; computational fluid dynamics; conduction; convection; cooling requirements; electronic circuit board; heat transfer; radiation; telecommunication board; Circuit simulation; Computational fluid dynamics; Computational modeling; Electronic circuits; Electronics cooling; Heat transfer; Mathematical model; Software measurement; Steady-state; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Telecommunication Technology, 2003. NCTT 2003 Proceedings. 4th National Conference on
Print_ISBN
0-7803-7773-7
Type
conf
DOI
10.1109/NCTT.2003.1188331
Filename
1188331
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