New topography expression model and 3D topography simulation of Al sputter deposition, etching, and photolithography

It is shown that the material surface can be described by the constant concentration area (the contour surface), by using the continuity principle at the material surface and considering the essential property of the material surface. Based on this model and the conservation of mass, the authors present a simulation algorithm and develop a 3D topography simulator (3D MULSS: Three-Dimensional Multi Layer Shape Simulator). It is demonstrated that this simulator can simulate the coverage of Al sputter deposition accurately, by comparing simulations and experimental results. 3D MULSS can also simulate the sequential processes of deposition, etching, and photolithography in three dimensions. In addition, it is shown that the proposed model can be applied to the surface tension by the 2D simulation of reflow.<>