Title :
Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330)
Abstract :
The following topics were dealt with. Array packaging; manufacturing optimisation; advanced interconnect technology; semiconductor technology; and system specific packaging
Keywords :
electronic equipment manufacture; interconnections; packaging; semiconductor technology; advanced interconnect technology; array packaging; manufacturing optimisation; semiconductor technology; system specific packaging;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1999. Twenty-Fourth IEEE/CPMT
Conference_Location :
Austin, TX, USA
Print_ISBN :
0-7803-5502-4
DOI :
10.1109/IEMT.1999.804772
