Adaptive fuzzy control of solder paste printing: the identification of deposit defects

Author

Howarth, Martin ; Lotfi, Ahmad

Author_Institution

Dept. of Mech. & Manuf. Eng., Nottingham Trent Univ., UK

fYear

1999

fDate

1999

Firstpage

102

Lastpage

107

Abstract

This paper presents the use of fuzzy logic to implement feature extraction and defect classification of an adaptive fuzzy control algorithm for the control of the solder paste stencil printing stage of surface mount printed circuit board (PCB) assembly. Experimental results are presented to illustrate the capability of the algorithm

Keywords

adaptive control; assembling; circuit reliability; fault diagnosis; feature extraction; fuzzy control; fuzzy logic; printed circuit manufacture; process control; soldering; surface mount technology; adaptive fuzzy control; adaptive fuzzy control algorithm; defect classification; deposit defect identification; feature extraction; fuzzy logic; solder paste printing; solder paste stencil printing control; solder paste stencil printing stage; surface mount PCB assembly; surface mount printed circuit board assembly; Adaptive control; Digital images; Fuzzy control; Histograms; Intelligent control; Manufacturing; Printing; Process control; Programmable control; Space technology;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 1999. Twenty-Fourth IEEE/CPMT

Conference_Location

Austin, TX

ISSN

1089-8190

Print_ISBN

0-7803-5502-4

Type

conf

DOI

10.1109/IEMT.1999.804802

Filename

804802