DocumentCode
3317635
Title
Surface micromachined linear thermal microactuator
Author
Judy, J.W. ; Tamagawa, T. ; Polla, D.L.
Author_Institution
Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
fYear
1990
fDate
9-12 Dec. 1990
Firstpage
629
Lastpage
632
Abstract
A linear thermal actuator based on controlled resistive heating of a suspended, micromachined, polysilicon (and silicon carbide) serpentine has been demonstrated. Maximum linear displacements of 1.5 mu m were measured for a polysilicon serpentine microbridge consisting of six bars (500 mu m*10 mu m*2 mu m). These displacements occur when sections of the micro-serpentine have been resistively heated to an average temperature change Delta T of 200 K to 500 K. Although this approach to linear actuation produces only small displacements, these thermally generated forces are significantly larger than those which can be obtained by electrostatic actuation methods. This novel thermal microactuator design is compatible with current IC processing techniques and may have applications for precision linear positioning or mechanical switching.<>
Keywords
electric actuators; elemental semiconductors; micromechanical devices; silicon; 200 to 500 K; IC processing techniques; average temperature change; controlled resistive heating; linear thermal microactuator; mechanical switching; polysilicon serpentine microbridge; precision linear positioning; thermally generated forces; Bars; Displacement measurement; Electrostatic actuators; Heating; Hydraulic actuators; Microactuators; Silicon carbide; Temperature control; Thermal force; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1990. IEDM '90. Technical Digest., International
Conference_Location
San Francisco, CA, USA
ISSN
0163-1918
Type
conf
DOI
10.1109/IEDM.1990.237120
Filename
237120
Link To Document