Single crystal silicon micro-actuators

A novel process suitable for fabricating single-crystal silicon microactuators is described. The process utilizes boron-diffused silicon etch stop to define the silicon microstructure thickness and a dry etch process to form narrow and deep trenches, followed by a silicon-to-glass bonding step and subsequent unmasked wafer dissolution. For rotational microactuators, polysilicon trench filling and sacrificial layer patterning are added to define a rotor stopper. The process successfully provided linear (stepped and resonant) and rotational (side-drive with rotor poles and harmonic side-drive) microactuators.<>