Title :
Component attachment in lithographic film circuits
Author :
Evans, P.S.A. ; Harrey, P.M. ; Ramsey, B.J. ; Harrison, D.J.
Author_Institution :
Brunel Univ., Uxbridge, UK
Abstract :
Conductive lithographic films are an emerging fabrication process for electronic circuits and systems. This paper reviews the manufacture and properties of CLF conductors, and describes a series of experiments to characterise bonds formed between them and surface-mount-technology (SMT) component packages employing electrically conductive adhesives. The purpose of this work is to directly compare the characteristics of solder joints between SMT packages on screen-printed alumina substrates, and conductive adhesive bonds formed between similar components and CLF substrates. The principal failure mechanisms of film-adhesive bonds in shear on various polymer substrate materials are identified and statistical data on bond strengths presented
Keywords :
adhesives; conducting polymers; failure analysis; hybrid integrated circuits; interconnections; lithography; mechanical strength; printed circuits; statistical analysis; surface mount technology; thick film circuits; CLF conductors; SMT component packages; SMT packages; bond characterisation; bond strengths; component attachment; conductive adhesive bonds; conductive lithographic films; electrically conductive adhesives; electronic circuits; electronic systems; fabrication process; failure mechanisms; film-adhesive bonds; lithographic film circuits; polymer substrate materials; screen-printed alumina substrates; shear; solder joints; statistical bond strength data; surface-mount-technology component packages; Conductive adhesives; Conductive films; Conductors; Electronic circuits; Electronics packaging; Fabrication; Pulp manufacturing; Soldering; Substrates; Surface-mount technology;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1999. Twenty-Fourth IEEE/CPMT
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-5502-4
DOI :
10.1109/IEMT.1999.804834
