Component attachment in lithographic film circuits

Author

Evans, P.S.A. ; Harrey, P.M. ; Ramsey, B.J. ; Harrison, D.J.

Author_Institution

Brunel Univ., Uxbridge, UK

fYear

1999

fDate

1999

Firstpage

282

Lastpage

286

Abstract

Conductive lithographic films are an emerging fabrication process for electronic circuits and systems. This paper reviews the manufacture and properties of CLF conductors, and describes a series of experiments to characterise bonds formed between them and surface-mount-technology (SMT) component packages employing electrically conductive adhesives. The purpose of this work is to directly compare the characteristics of solder joints between SMT packages on screen-printed alumina substrates, and conductive adhesive bonds formed between similar components and CLF substrates. The principal failure mechanisms of film-adhesive bonds in shear on various polymer substrate materials are identified and statistical data on bond strengths presented

Keywords

adhesives; conducting polymers; failure analysis; hybrid integrated circuits; interconnections; lithography; mechanical strength; printed circuits; statistical analysis; surface mount technology; thick film circuits; CLF conductors; SMT component packages; SMT packages; bond characterisation; bond strengths; component attachment; conductive adhesive bonds; conductive lithographic films; electrically conductive adhesives; electronic circuits; electronic systems; fabrication process; failure mechanisms; film-adhesive bonds; lithographic film circuits; polymer substrate materials; screen-printed alumina substrates; shear; solder joints; statistical bond strength data; surface-mount-technology component packages; Conductive adhesives; Conductive films; Conductors; Electronic circuits; Electronics packaging; Fabrication; Pulp manufacturing; Soldering; Substrates; Surface-mount technology;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 1999. Twenty-Fourth IEEE/CPMT

Conference_Location

Austin, TX

ISSN

1089-8190

Print_ISBN

0-7803-5502-4

Type

conf

DOI

10.1109/IEMT.1999.804834

Filename

804834