• DocumentCode
    3317800
  • Title

    AC hot-carrier degradation due to gate-pulse-induced noise

  • Author

    Izawa, R. ; Umeda, K. ; Takeda, E.

  • Author_Institution
    Hitachi Ltd., Tokyo, Japan
  • fYear
    1990
  • fDate
    9-12 Dec. 1990
  • Firstpage
    573
  • Lastpage
    576
  • Abstract
    Hot-carrier degradation mechanisms under AC stress are investigated by taking into account gate-pulse-induced noise effects. It is found that the increase of AC hot-carrier degradation is due to the wiring inductance effect in ULSI circuits and in measurement systems. Except for this noise effect, other peculiar effects at the falling and/or rising edges of the gate pulse can be disregarded. As a result, the lifetime under AC stress conditions can be predicted using the DC lifetime and duty cycles. In addition, circuit impedance guidelines for suppressing induced noise are proposed, based on a detailed analysis of noise mechanisms.<>
  • Keywords
    MOS integrated circuits; VLSI; electron device noise; hot carriers; wiring; AC hot-carrier degradation; ULSI circuits; circuit impedance guidelines; duty cycles; gate-pulse-induced noise; lifetime; noise mechanisms; wiring inductance; Circuit noise; Degradation; Guidelines; Hot carrier effects; Hot carriers; Impedance; Inductance measurement; Stress; Ultra large scale integration; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1990. IEDM '90. Technical Digest., International
  • Conference_Location
    San Francisco, CA, USA
  • ISSN
    0163-1918
  • Type

    conf

  • DOI
    10.1109/IEDM.1990.237133
  • Filename
    237133