Title :
How to assemble large PBGAs on PCB reliably with large PQFPs directly on the opposite side?
Author :
Lau, John H. ; Lee, Ricky ; Chao, Henry
Author_Institution :
Express Packaging Syst. Inc., Palo Alto, CA, USA
Abstract :
A two-sided no clean mass reflow process for large plastic ball grid array (PBGA) and plastic quad flat pack (PQFP) packages is presented. Emphasis is placed on the PBGA and PQFP assembly parameters such as the design, materials, and processing of the packages and printed circuit board (PCB), solder paste, stencil printing, pick-and-place, reflow, and inspection. The solder joint reliability of the two-sided PCB assembly is evaluated by shear tests and thermal cycling tests
Keywords :
assembling; ball grid arrays; circuit reliability; inspection; integrated circuit packaging; mechanical testing; plastic packaging; printed circuit design; printed circuit manufacture; printed circuit testing; production testing; reflow soldering; thermal stresses; PBGA assembly parameters; PBGA packages; PBGAs; PCB; PCB design; PCB materials; PCB processing; PQFP assembly parameters; PQFP packages; PQFPs; assembly; inspection; package design; package materials; package processing; package size; pick-and-place; plastic ball grid array; plastic quad flat pack; printed circuit board; reflow; shear tests; solder joint reliability; solder paste; stencil printing; thermal cycling tests; two-sided PCB assembly; two-sided no clean mass reflow process; Acoustic testing; Assembly; Circuit testing; Components, packaging, and manufacturing technology; Electronic packaging thermal management; Electronics packaging; Inspection; Plastic packaging; Printing; Soldering;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1999. Twenty-Fourth IEEE/CPMT
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-5502-4
DOI :
10.1109/IEMT.1999.804858
