• DocumentCode
    3318353
  • Title

    Simulation, design, and fabrication of thin-film resistive-gate GaAs charge coupled devices

  • Author

    Ula, N. ; Cooper, G. ; Davidson, C. ; Swierkowski, S.P. ; Hunt, C.E.

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., California Univ., Davis, CA, USA
  • fYear
    1990
  • fDate
    9-12 Dec. 1990
  • Firstpage
    271
  • Lastpage
    274
  • Abstract
    Computer simulation of high-speed-gallium-arsenide charge coupled devices (CCDs) is performed using an established two-dimensional semiconductor device simulation program. The effect of active layer thickness on the charge transfer efficiency (CTE) and the dynamic range is investigated using different active layers. Also, different gate architectures are compared for optimum dynamic range and compatibility with GaAs MESFET technology. Both capacitive gate CCD and resistive gate CCD are considered. It is shown that both dynamic range and, to a greater extent, CTE, decrease with decreasing active layer thickness. In general, thicker active layer CCDs have a higher dynamic range and faster operating frequencies.<>
  • Keywords
    III-V semiconductors; charge-coupled device circuits; gallium arsenide; semiconductor device models; active layer thickness; capacitive gate; charge transfer efficiency; design; dynamic range; fabrication; gate architectures; operating frequencies; resistive gate; semiconductors; Charge coupled devices; Charge transfer; Charge-coupled image sensors; Computational modeling; Computer simulation; Dynamic range; Fabrication; Semiconductor devices; Semiconductor thin films; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1990. IEDM '90. Technical Digest., International
  • Conference_Location
    San Francisco, CA, USA
  • ISSN
    0163-1918
  • Type

    conf

  • DOI
    10.1109/IEDM.1990.237177
  • Filename
    237177