DocumentCode
3318353
Title
Simulation, design, and fabrication of thin-film resistive-gate GaAs charge coupled devices
Author
Ula, N. ; Cooper, G. ; Davidson, C. ; Swierkowski, S.P. ; Hunt, C.E.
Author_Institution
Dept. of Electr. Eng. & Comput. Sci., California Univ., Davis, CA, USA
fYear
1990
fDate
9-12 Dec. 1990
Firstpage
271
Lastpage
274
Abstract
Computer simulation of high-speed-gallium-arsenide charge coupled devices (CCDs) is performed using an established two-dimensional semiconductor device simulation program. The effect of active layer thickness on the charge transfer efficiency (CTE) and the dynamic range is investigated using different active layers. Also, different gate architectures are compared for optimum dynamic range and compatibility with GaAs MESFET technology. Both capacitive gate CCD and resistive gate CCD are considered. It is shown that both dynamic range and, to a greater extent, CTE, decrease with decreasing active layer thickness. In general, thicker active layer CCDs have a higher dynamic range and faster operating frequencies.<>
Keywords
III-V semiconductors; charge-coupled device circuits; gallium arsenide; semiconductor device models; active layer thickness; capacitive gate; charge transfer efficiency; design; dynamic range; fabrication; gate architectures; operating frequencies; resistive gate; semiconductors; Charge coupled devices; Charge transfer; Charge-coupled image sensors; Computational modeling; Computer simulation; Dynamic range; Fabrication; Semiconductor devices; Semiconductor thin films; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1990. IEDM '90. Technical Digest., International
Conference_Location
San Francisco, CA, USA
ISSN
0163-1918
Type
conf
DOI
10.1109/IEDM.1990.237177
Filename
237177
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