Title :
Fiber-chip-coupling based on in InP V-groove technology
Author :
Alder, T. ; Heinzelmann, R. ; Leonhard, S. ; Stöhr, A. ; Jäger, D.
Author_Institution :
Gerhard-Mercator-Univ., Duisburg, Germany
Abstract :
We study a simple and low cost technological concept for active or passive fiber-waveguide coupling. Lateral and vertical alignment of optical fibers is achieved using InP V-grooves. Using conventional photolithography, wet chemical etching techniques and a special acrylic adhesive, tapered and non-tapered single mode fibers (SMF) have been coupled to 1.55 μm waveguide electroabsorption (EA) modulators. Experimentally, a fiber-chip coupling loss of 9.5 dB is determined for non-tapered cleaved single mode fibers. Preliminary experimental results using tapered SMF exhibit a lower coupling loss and from numerical simulations a minimum coupling loss of less than 2.5 dB is expected. To our knowledge, this is the first time, InP V-groove technology is utilized for fiber-chip coupling of a waveguide EA-modulator
Keywords :
III-V semiconductors; electro-optical modulation; electroabsorption; etching; indium compounds; integrated optics; optical communication equipment; optical couplers; optical fabrication; optical fibre couplers; optical fibre losses; photolithography; 1.55 μm waveguide electroabsorption modulators; 1.55 mum; 2.5 dB; 9.5 dB; InP; InP V-groove technology; acrylic adhesive; active fiber-waveguide coupling; fiber-chip coupling; fiber-chip-coupling; lateral alignment; low cost technological concept; lower coupling loss; minimum coupling loss; non-tapered single mode fibers; optical fibre couplers; passive fiber-waveguide coupling; photolithography; tapered single mode fibers; vertical alignment; waveguide EA-modulator; wet chemical etching techniques; Arc discharges; Fabrication; Lenses; Optical fiber devices; Optical fibers; Optical materials; Optical waveguides; Rough surfaces; Standards development; Surface roughness;
Conference_Titel :
Lasers and Electro-Optics Society Annual Meeting, 1998. LEOS '98. IEEE
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-4947-4
DOI :
10.1109/LEOS.1998.737722