• DocumentCode
    3318599
  • Title

    A new efficient method for the transient simulation of three-dimensional interconnect structures

  • Author

    Kumashiro, S. ; Rohrer, R.A. ; Strojwas, A.J.

  • fYear
    1990
  • fDate
    9-12 Dec. 1990
  • Firstpage
    193
  • Lastpage
    196
  • Abstract
    An efficient method for the transient simulation of 3D interconnect structures has been developed. In this method, the time response is calculated in terms of a few poles of approximation in the frequency domain rather than via an ordinary time-domain integration method. An interconnect structure is represented in terms of equivalent 3D RC mesh networks and the transfer function of this linear circuit is then approximated by using a partial fraction series of a few poles. In order to facilitate the calculation of the transfer function, state equations are derived based on a nodal circuit analysis approach. The ICCG matrix solver has been successfully applied to the resultant matrices from the equations. It is shown that this method can produce transient responses one order of magnitude faster than conventional methods.<>
  • Keywords
    circuit analysis computing; circuit layout; equivalent circuits; frequency-domain analysis; integrated circuit technology; matrix algebra; metallisation; poles and zeros; transfer functions; transient response; ICCG matrix solver; equivalent 3D RC mesh networks; frequency domain; linear circuit; nodal circuit analysis approach; partial fraction series; state equations; three-dimensional interconnect structures; time response; transfer function; transient responses; transient simulation; Circuit analysis; Equations; Frequency domain analysis; Integrated circuit interconnections; Linear circuits; Mesh networks; Time domain analysis; Time factors; Transfer functions;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1990. IEDM '90. Technical Digest., International
  • Conference_Location
    San Francisco, CA, USA
  • ISSN
    0163-1918
  • Type

    conf

  • DOI
    10.1109/IEDM.1990.237195
  • Filename
    237195