DocumentCode
331870
Title
Flip chip bonders for high end optoelectronic modules
Author
Cooper, K.A.
Author_Institution
Karl Suss America Inc., Waterbury Center, VT, USA
Volume
1
fYear
1998
fDate
1-4 Dec 1998
Firstpage
97
Abstract
A new flip chip bonder for very high accuracy assembly of optoelectronic devices is described. Attention will be focussed on mechanical and thermal design and performance issues, with bonding results from a laser diode device
Keywords
chip scale packaging; flip-chip devices; integrated circuit bonding; integrated optoelectronics; soldering; flip chip bonders; high end optoelectronic modules; laser diode device; mechanical design; passive alignment; performance; solder assembly; thermal design; very high accuracy assembly; Assembly; Bonding; Costs; Data communication; Diode lasers; Flip chip; Optical design; Optoelectronic devices; Passive optical networks; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics Society Annual Meeting, 1998. LEOS '98. IEEE
Conference_Location
Orlando, FL
Print_ISBN
0-7803-4947-4
Type
conf
DOI
10.1109/LEOS.1998.737751
Filename
737751
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