A low-cost electroless plating method for producing flip-chip bondable and wire-bondable circuit pads for smart pixel application

Author

Datta, Madhumita ; Merritt, Scott A. ; Stone, Dennis ; Dagenais, Mario

Author_Institution

Maryland Univ., College Park, MD, USA

Volume

1

fYear

1998

fDate

1-4 Dec 1998

Firstpage

99

Abstract

We have developed and optimized a step-by-step electroless re-metallization process for aluminum that can reduce the cost and complication of substrate preparation for flip-chip microassembly. Our current effort is to utilize the same electroless plating process to coat optical fibers with a solderable nickel/gold layer, to make them suitable for silicon waferboard integration

Keywords

chip scale packaging; electroless deposition; flip-chip devices; integrated circuit metallisation; integrated optoelectronics; microassembling; optical interconnections; semiconductor laser arrays; smart pixels; soldering; surface emitting lasers; CMOS driver chip; VCSEL based free-space optoelectronics; complete electroless process cycle; flip-chip bondable circuit pads; flip-chip microassembly; flip-chip solder bonding; high-density interconnects; hybrid smart pixel array element; low-cost electroless plating method; reliable re-metallization technique; silicon waferboard integration; smart pixel application; solderable nickel/gold layer; wire-bondable circuit pads; Aluminum; Atherosclerosis; Bonding; Circuits; Gold; Metallization; Nickel; Smart pixels; Vertical cavity surface emitting lasers; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Lasers and Electro-Optics Society Annual Meeting, 1998. LEOS '98. IEEE

Conference_Location

Orlando, FL

Print_ISBN

0-7803-4947-4

Type

conf

DOI

10.1109/LEOS.1998.737752

Filename

737752