Title :
Flip-chip bonding of VCSEL arrays with silicon driver chips for high speed data links
Author :
Koelle, U. ; Johnson, S.R. ; Kelkar, P. ; Turpin, R. ; Dowd, P. ; Pan, G. ; Zhang, Y-H
Author_Institution :
Center for Solid State Electron. Res., Arizona State Univ., Tempe, AZ, USA
Abstract :
Summary form only given. We have demonstrated an 8x8 VCSEL array flip-chip bonded to a dummy silicon chip that mimics the real CMOS driver IC by using Al metal lines and contact pads. All the bonded devices operated reliably, showing only a small variation in wavelength, threshold current and power output across the array. This demonstrates the suitability of this bonding technique for the integration of VCSEL arrays with high speed Si-based CMOS driver ICs
Keywords :
CMOS digital integrated circuits; data communication; driver circuits; flip-chip devices; integrated optoelectronics; optical interconnections; quantum well lasers; semiconductor laser arrays; silicon; surface emitting lasers; 8x8 VCSEL array flip-chip; Al metal lines; Si; VCSEL arrays; bonded devices; contact pads; dummy silicon chip; flip-chip bonding; high speed Si-based CMOS driver ICs; high speed data links; power output; real CMOS driver IC; reliably; silicon driver chips; threshold current; Bonding; Data communication; Driver circuits; Gallium arsenide; Integrated circuit interconnections; Optical devices; Optical interconnections; Silicon; Threshold current; Vertical cavity surface emitting lasers;
Conference_Titel :
Lasers and Electro-Optics Society Annual Meeting, 1998. LEOS '98. IEEE
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-4947-4
DOI :
10.1109/LEOS.1998.737783
