DocumentCode :
3319090
Title :
Modeling of High Frequency Noise in SOI MOSFETs
Author :
Varadharajaperumal, Muthubalan ; Sirohi, Saurabh ; Khandelwal, Sourabh ; Tamilmani, Ethirajan ; Subramanian, Vaidyanathan
Author_Institution :
Semicond. R&D Center, IBM India Pvt. Ltd., Bangalore, India
fYear :
2010
fDate :
3-7 Jan. 2010
Firstpage :
212
Lastpage :
217
Abstract :
The high frequency thermal noise sets the lower limit of the detectable signals in the receiver RF front-end systems.Hence it is very important that the models for thermal noise should be more accurate and physical. In this paper, we model thermal noise with BSIMSOI and PSPSOI models and compare it with the hardware data. The comparison is done for two types of FET:thick gate-oxide NFET (5.2 nm) and thin gate-oxide NFET (3.2 nm). The hardware correlation between the PSPSOI and BSIMSOI models are compared and the PSPSOI model is found to model the hardware data more accurately. The noise performance between the thin oxide and thick oxide NFETs are compared and the thin oxide FET has been found to have a better noise performance.
Keywords :
MOSFET; semiconductor device models; semiconductor device noise; silicon-on-insulator; thermal noise; BSIMSOI models; FET-thick gate-oxide NFET; PSPSOI models; SOI MOSFET modeling; Si; high frequency thermal noise; noise performance; receiver RF front-end systems; size 3.2 nm; size 5.2 nm; thin gate-oxide NFET; CMOS technology; Circuit noise; FETs; Fluctuations; Hardware; MOSFETs; Noise generators; Radio frequency; Semiconductor device noise; Silicon on insulator technology; Channel Noise; Noise Figure; Thermal Noise; Thick Oxide FET; Thin Oxide FET;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Design, 2010. VLSID '10. 23rd International Conference on
Conference_Location :
Bangalore
ISSN :
1063-9667
Print_ISBN :
978-1-4244-5541-6
Type :
conf
DOI :
10.1109/VLSI.Design.2010.82
Filename :
5401193
Link To Document :
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