DocumentCode
3319340
Title
Enabling wireless communications with state-of-the-art RF CMOS and SiGe BiCMOS technologies
Author
Chu, S.F. ; Chew, K.W. ; Verma, P.R. ; Ng, C.H. ; Cheng, C.H. ; Toledo, N.G. ; Yoo, Y.K. ; Loh, W.B. ; Leong, K.C. ; Zhang, S.Q. ; Oon, B.G. ; Poh, Y.W. ; Zhou, T. ; Khu, K.K. ; Lim, S.F.
Author_Institution
Div. of Device Technol., Chartered Semicond. Manuf. Ltd., Singapore
fYear
2005
fDate
30 Nov.-2 Dec. 2005
Firstpage
115
Lastpage
118
Abstract
The choice of technology for today´s mixed-signal/RF system-on-chip (SOC) designs has been driven by the performance enhancements and cost advantage derived from scaled CMOS technologies. This paper discusses the performance improvements of RF transistors resulting from technology downscaling. Comparisons between scaled RF CMOS and SiGe BiCMOS technologies to highlight the benefits of employing SiGe HBT devices in certain applications are made. Other technology enablements discussed include accurate, scalable models and statistical models to address the need for design flexibility and robust manufacturing. Thereafter the introduction of high Q inductors, high density capacitors and varactors as basic passive components for RF circuits are discussed. Analog requirements such as mismatch, temperature linearity and voltage linearity are also discussed.
Keywords
BiCMOS integrated circuits; germanium; heterojunction bipolar transistors; radio networks; radiofrequency integrated circuits; silicon; statistical analysis; system-on-chip; varactors; BiCMOS technologies; HBT devices; RF CMOS; RF system-on-chip; RF transistors; SOC; high Q inductors; high density capacitors; mixed-signal system-on-chip; varactors; wireless communications; BiCMOS integrated circuits; CMOS technology; Costs; Germanium silicon alloys; Linearity; Radio frequency; Semiconductor device modeling; Silicon germanium; System-on-a-chip; Wireless communication; MIM capacitors; MOS varactors; RF CMOS; SiGe BiCMOS; VPP capacitors; f; inductors; linearity; mismatch; scalable models; statistical models;
fLanguage
English
Publisher
ieee
Conference_Titel
Radio-Frequency Integration Technology: Integrated Circuits for Wideband Communication and Wireless Sensor Networks, 2005. Proceedings. 2005 IEEE International Workshop on
Print_ISBN
0-7803-9372-4
Type
conf
DOI
10.1109/RFIT.2005.1598888
Filename
1598888
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