• DocumentCode
    3319340
  • Title

    Enabling wireless communications with state-of-the-art RF CMOS and SiGe BiCMOS technologies

  • Author

    Chu, S.F. ; Chew, K.W. ; Verma, P.R. ; Ng, C.H. ; Cheng, C.H. ; Toledo, N.G. ; Yoo, Y.K. ; Loh, W.B. ; Leong, K.C. ; Zhang, S.Q. ; Oon, B.G. ; Poh, Y.W. ; Zhou, T. ; Khu, K.K. ; Lim, S.F.

  • Author_Institution
    Div. of Device Technol., Chartered Semicond. Manuf. Ltd., Singapore
  • fYear
    2005
  • fDate
    30 Nov.-2 Dec. 2005
  • Firstpage
    115
  • Lastpage
    118
  • Abstract
    The choice of technology for today´s mixed-signal/RF system-on-chip (SOC) designs has been driven by the performance enhancements and cost advantage derived from scaled CMOS technologies. This paper discusses the performance improvements of RF transistors resulting from technology downscaling. Comparisons between scaled RF CMOS and SiGe BiCMOS technologies to highlight the benefits of employing SiGe HBT devices in certain applications are made. Other technology enablements discussed include accurate, scalable models and statistical models to address the need for design flexibility and robust manufacturing. Thereafter the introduction of high Q inductors, high density capacitors and varactors as basic passive components for RF circuits are discussed. Analog requirements such as mismatch, temperature linearity and voltage linearity are also discussed.
  • Keywords
    BiCMOS integrated circuits; germanium; heterojunction bipolar transistors; radio networks; radiofrequency integrated circuits; silicon; statistical analysis; system-on-chip; varactors; BiCMOS technologies; HBT devices; RF CMOS; RF system-on-chip; RF transistors; SOC; high Q inductors; high density capacitors; mixed-signal system-on-chip; varactors; wireless communications; BiCMOS integrated circuits; CMOS technology; Costs; Germanium silicon alloys; Linearity; Radio frequency; Semiconductor device modeling; Silicon germanium; System-on-a-chip; Wireless communication; MIM capacitors; MOS varactors; RF CMOS; SiGe BiCMOS; VPP capacitors; f; inductors; linearity; mismatch; scalable models; statistical models;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Radio-Frequency Integration Technology: Integrated Circuits for Wideband Communication and Wireless Sensor Networks, 2005. Proceedings. 2005 IEEE International Workshop on
  • Print_ISBN
    0-7803-9372-4
  • Type

    conf

  • DOI
    10.1109/RFIT.2005.1598888
  • Filename
    1598888