Title :
60-GHz-band LTCC module technology for wireless gigabit transceiver applications
Author :
Maruhashi, Kenichi ; Ito, Masaharu ; Kishimoto, Shuya ; Ohata, Keiichi
Author_Institution :
Syst. Devices Res. Lab., NEC Corp., Shiga, Japan
fDate :
30 Nov.-2 Dec. 2005
Abstract :
This paper presents 60-GHz-band module technology for gigabit wireless systems. All millimeter-wave components described here are flip-chip mountable devices, providing highly repeatable interconnects even for such a high-frequency range. For multi-chip modules, multi-layer LTCC substrates with cavity structures are employed, where MMICs, filters and dielectric resonator oscillators are mounted. Once the module fabrication is completed, only DC feeding and baseband I/O should be cared to connect with printed wiring boards. For 60-GHz-band ASK modules, modulation/demodulation with a speed more than 1 Gb/s and an output power of 10 mW are achieved. The modules are implemented in several applications. The uncompressed high-definition video transmission systems are highlighted.
Keywords :
amplitude shift keying; ceramics; flip-chip devices; high definition television; multichip modules; transceivers; video communication; 10 mW; 60 GHz; ASK modules; LTCC module technology; MMIC; cavity structures; demodulation; dielectric resonator oscillators; filters; flip-chip mountable devices; high-definition video transmission systems; millimeter-wave components; modulation; printed wiring boards; wireless gigabit transceiver; Amplitude shift keying; Baseband; Dielectric substrates; Fabrication; MMICs; Millimeter wave technology; Oscillators; Resonator filters; Transceivers; Wiring; Ceramics; Dielectric resonator oscillators; Flip-chip devices; HDTV; MIMICs; Millimeter wave radio communication;
Conference_Titel :
Radio-Frequency Integration Technology: Integrated Circuits for Wideband Communication and Wireless Sensor Networks, 2005. Proceedings. 2005 IEEE International Workshop on
Print_ISBN :
0-7803-9372-4
DOI :
10.1109/RFIT.2005.1598892
