Emerging manufacturing technologies for RFIC, antenna and RF-MEMS integration

Author

Lu, Albert Chee W ; Chua, Kai M. ; Guo, Li Hui

Author_Institution

Singapore Inst. of Manufacturing Technol., Singapore

fYear

2005

fDate

30 Nov.-2 Dec. 2005

Firstpage

142

Lastpage

146

Abstract

Insatiable demand for miniaturization and environmental friendly materials in next-generation electronic based products is driving the need for advanced low-cost and scalable manufacturing processes. To meet customers´ needs today, ranging from communications to healthcare markets, tight integration of multiple functionalities is required. The conventional approach to multi-functional integration involves assembly and packaging of discrete components, active devices, etc. A holistic approach towards multi-functional integration to improve system cost-effectiveness, particularly for the next-generation RF microsystems and subsystems, is described, along with the unique manufacturing technologies.

Keywords

antennas; electronic products; manufacturing processes; micromechanical devices; radiofrequency integrated circuits; RF-MEMS integration; RFIC; antenna; components assembly; components packaging; healthcare markets; holistic approach; manufacturing processes; multi-functional integration; multiple functionalities; next-generation RF microsystems; next-generation electronic based products; Assembly; Components, packaging, and manufacturing technology; Manufacturing processes; Micromechanical devices; Packaging; Q factor; Radio frequency; Radiofrequency integrated circuits; Radiofrequency microelectromechanical systems; Silicon; Embedded Passives; LTCC; MEMS; Multi-functional Integration; RFIC; WTT;

fLanguage

English

Publisher

ieee

Conference_Titel

Radio-Frequency Integration Technology: Integrated Circuits for Wideband Communication and Wireless Sensor Networks, 2005. Proceedings. 2005 IEEE International Workshop on

Print_ISBN

0-7803-9372-4

Type

conf

DOI

10.1109/RFIT.2005.1598895

Filename

1598895