DocumentCode :
3319488
Title :
Mechanical properties of microspring thin films fabricated by glancing angle deposition (GLAD)
Author :
Seto, M.W. ; Robbie, K. ; Brett, M.J.
Author_Institution :
Dept. of Electr. & Comput. Eng., Alberta Univ., Edmonton, Alta., Canada
Volume :
3
fYear :
1999
fDate :
9-12 May 1999
Firstpage :
1616
Abstract :
Unique thin film microstructures have been fabricated with the Glancing Angle Deposition (GLAD) technique. These porous, thin films can be engineered with a variety of many different morphologies to sub-micron dimensions. Mechanical properties of helically structured thin films were studied with a nanoindentation technique, allowing properties such as the spring constant to be determined. Present work on the study of these "microspring-beds" is ongoing, and includes the determination of resonant frequencies and application to potential devices.
Keywords :
indentation; micromechanical devices; porous materials; vapour deposited coatings; fabrication; glancing angle deposition; helical structure; mechanical properties; microspring bed; microspring thin film; nanoindentation; physical vapour deposition; porous microstructure; resonant frequency; spring constant; Mechanical factors; Microstructure; Morphology; Motion control; Shape control; Springs; Sputtering; Substrates; Testing; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical and Computer Engineering, 1999 IEEE Canadian Conference on
Conference_Location :
Edmonton, Alberta, Canada
ISSN :
0840-7789
Print_ISBN :
0-7803-5579-2
Type :
conf
DOI :
10.1109/CCECE.1999.804958
Filename :
804958
Link To Document :
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