3319866

Proceedings of the 4th International Symposium on Electronic Materials and Packaging (Cat. No.02EX634)

2002

4-6 Dec. 2002

ceramic packaging; circuit simulation; integrated circuit modelling; integrated circuit packaging; integrated circuit testing; interconnections; materials testing; reliability; semiconductor device models; semiconductor device packaging; soldering; surface mount technology; thermal management (packaging); LTCC; SMT; electronic materials; electronic packaging; embedded components; interconnect technologies; low temperature cofired ceramics; materials characterization; measurement; modeling; packaging reliability; simulation; solders; testing; thermal management;

English

ieee

Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on

Kaohsiung, Taiwan

0-7803-7682-X

conf

10.1109/EMAP.2002.1188804

1188804