• DocumentCode
    3319998
  • Title

    A Unified Approach for IP Protection across Design Phases in a Packaged Chip

  • Author

    Saha, Debasri ; Sur-Kolay, Susmita

  • Author_Institution
    Adv. Comput. & Microelectron. Unit, Indian Stat. Inst., Kolkata, India
  • fYear
    2010
  • fDate
    3-7 Jan. 2010
  • Firstpage
    105
  • Lastpage
    110
  • Abstract
    IP values contributed by the distinct design tools in specific design phases, are recognized by observing the signature of the owner of each tool as functional or scan mode output of the fabricated chip, for certain input vector secret to the owner. An existing approach inserts watermark through reordering of single scan chain, and solely identifies the owner of the logic design tool. Here we propose a novel scheme to watermark the recent reconfigurable scan architectures, operating in both scan tree and single scan mode. The signature of the owner of physical design tool along with that of logic design tool can separately be embedded while designing the scan tree and also verified from the packaged chip without conflict using two distinct modes. A bi-objective minimization of overhead in routing and power is supported through our scheme. Experimental results on design overhead and robustness for ISCAS´89 benchmarks are encouraging.
  • Keywords
    VLSI; design for testability; industrial property; logic design; watermarking; IP protection; ISCAS 89 benchmarks; VLSI; bi-objective minimization; design phases; functional signature; logic design tool; packaged chip; reconfigurable scan architectures; scan mode output; single scan chain; watermark; Circuits; Design optimization; Hardware; Intellectual property; Logic design; Observability; Packaging; Protection; Very large scale integration; Watermarking; Design-for-Testability; Intellectual Property Protection; embedding of signature; observabality; scan tree architecture;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Design, 2010. VLSID '10. 23rd International Conference on
  • Conference_Location
    Bangalore
  • ISSN
    1063-9667
  • Print_ISBN
    978-1-4244-5541-6
  • Type

    conf

  • DOI
    10.1109/VLSI.Design.2010.52
  • Filename
    5401252