Title :
Exploring the determinants of technological follow-on in new technological areas
Author :
Wu, Hsueh-Liang ; Huang, Ming-Chao
Author_Institution :
Grad. Inst. of Bus. Adm., Nat. Cheng Kung Univ., Tainan, Taiwan
fDate :
July 29 2007-Aug. 1 2007
Abstract :
A creative idea or an invention per se is not associated with a real advantage, while follow-on patenting or product development activities are. Drawing on the real options reasoning, this paper aims to explore the nature of R&D investment decisions that drive a firm to deepen its foothold in a new technological area. Using Cox regression model upon the patent data of top bearing companies worldwide over the period 1990-2004, we identified the influences of technology-, firm- and market-related constructs, namely, age of knowledge searched, accumulated knowledge stock, and competitive effects, on the focal firm´s follow-on patenting behavior. Our results highlight the critical role of organizational learning patterns in determining the incidence of innovation persistence, and suggest the context-dependent nature of such technological deepening behaviors. The empirical findings shed light on R&D investment strategies when firms are subject to the uncertainty of technological environments.
Keywords :
decision making; innovation management; investment; organisational aspects; patents; regression analysis; research and development; technological forecasting; Cox regression model; follow-on patenting; innovation persistence; investment decisions; organizational learning patterns; product development; research and development; technological follow-on; Business; Environmental management; History; Investments; Pharmaceutical technology; Product development; Research and development; Technological innovation; Technology forecasting; Uncertainty; Disruptive and emerging technologies; Forecasting and technology prediction; R&D Management;
Conference_Titel :
Engineering Management Conference, 2007 IEEE International
Conference_Location :
Austin, TX
Print_ISBN :
978-1-4244-2145-9
Electronic_ISBN :
978-1-4244-2146-6
DOI :
10.1109/IEMC.2007.5235028