• DocumentCode
    3321117
  • Title

    Effects of thermo-mechanical stress in solder joints under high current stressing

  • Author

    Zhang, Jinsong ; Wu, Yiping ; Xi, Hongjia ; An, Bing ; Wu, Fengshun

  • fYear
    2007
  • fDate
    14-17 Aug. 2007
  • Firstpage
    1
  • Lastpage
    5
  • Keywords
    Current density; Electromigration; Heating; Joining materials; Materials science and technology; Petroleum; Soldering; Temperature; Thermal stresses; Thermomechanical processes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-1392-8
  • Electronic_ISBN
    978-1-4244-1392-8
  • Type

    conf

  • DOI
    10.1109/ICEPT.2007.4497324
  • Filename
    4497324
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3321117