DocumentCode :
3321371
Title :
Numerical extraction of partial inductance of package reference (power/ground) planes
Author :
Cai, X.-D. ; Costache, G.I. ; Laroussi, R. ; Crawhall, R.
Author_Institution :
Dept. of Electr. Eng., Ottawa Univ., Ont., Canada
fYear :
195
fDate :
14-18 Aug 195
Firstpage :
12
Lastpage :
15
Abstract :
This paper presents a numerical approach for extracting the partial inductance of package reference (power/ground) planes using the finite element method. A simpler method is proposed to determine the partial inductance between two or three sources and sinks which are of importance in EMC/EMI considerations. An application is presented to verify the partial inductance obtained by R. Lee Hill et al (see Proc. IEEE Int. Symp. EMC, p.116-120, August 1994), where the partial inductance was modeled by a symmetrical coplanar circuit. Good agreement has been found between the numerical and theoretical results
Keywords :
electromagnetic compatibility; electromagnetic interference; finite element analysis; inductance; packaging; EMC; EMI; finite element method; numerical extraction; package reference; partial inductance; power/ground planes; sinks; symmetrical coplanar circuit; Current distribution; Electric potential; Electromagnetic compatibility; Electromagnetic interference; Finite element methods; Inductance; Integrated circuit packaging; Magnetic analysis; Magnetic fields;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility, 1995. Symposium Record., 1995 IEEE International Symposium on
Conference_Location :
Atlanta, GA
Print_ISBN :
0-7803-3608-9
Type :
conf
DOI :
10.1109/ISEMC.1995.523510
Filename :
523510
Link To Document :
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