• DocumentCode
    3321499
  • Title

    Analog Circuit Design Methodologies to Improve Negative-Bias Temperature Instability Degradation

  • Author

    Ghosh, Amlan ; Franklin, Rob ; Brown, Richard B.

  • Author_Institution
    Univ. of Utah, Salt Lake City, UT, USA
  • fYear
    2010
  • fDate
    3-7 Jan. 2010
  • Firstpage
    369
  • Lastpage
    374
  • Abstract
    Negative-bias temperature instability (NBTI) has become one of the major sources of performance degradation in scaled PMOS devices, affecting the threshold voltages of the devices, which in turn affects yield and lifetime reliability as well as the power consumption and performance of circuits. Hence, it has become necessary to understand and reduce the impact of NBTI on PMOS devices. This paper identifies the characteristic of PMOS stresses in differential pairs. Two techniques are proposed for improving performance in the face of NBTI-switching the inputs of the differential transistors, and body-bias modulation based on offset in the common mode output. Simulation results are described. Both techniques bring the offset voltage to a very low value. The body biasing technique improves the output characteristic transition window width from 0.11 V to 0.02 V.
  • Keywords
    CMOS analogue integrated circuits; circuit stability; integrated circuit design; integrated circuit reliability; CMOS; NBTI; analog circuit design methodologies; body-bias modulation; common mode output; differential transistors; lifetime reliability; negative-bias temperature instability degradation; offset voltage; power consumption; scaled PMOS devices; threshold voltages; transition window width; voltage 0.02 V; Analog circuits; Degradation; Design methodology; Energy consumption; MOS devices; Niobium compounds; Stress; Temperature; Threshold voltage; Titanium compounds; NBTI; analog circuit design methodologies; body biasing.; input switching;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Design, 2010. VLSID '10. 23rd International Conference on
  • Conference_Location
    Bangalore
  • ISSN
    1063-9667
  • Print_ISBN
    978-1-4244-5541-6
  • Type

    conf

  • DOI
    10.1109/VLSI.Design.2010.69
  • Filename
    5401333