DocumentCode :
3321858
Title :
Application of the thermal diode concept for the utilization of solar energy
Author :
Chun, Wongee ; Lee, Yoon Joon ; Lee, Jae Young ; Chen, Kuan ; Kim, Hyung Taek ; Lee, Tai Kyu
Author_Institution :
Dept. of Nucl. & Energy Eng., Cheju Nat. Univ., South Korea
Volume :
3
fYear :
1996
fDate :
11-16 Aug 1996
Firstpage :
1709
Abstract :
This paper introduces a number of numerical and experimental investigations to harness the Sun´s energy using the thermal diode concept. Three different types of thermal diodes are constructed and tested following the numerical simulation to verify their actual performance and adaptability (feasibility). Of these, the first model is a simple thermal diode consisting of a number of rectangular loops whose direction of heat transfer can be easily manipulated either manually or automatically. The second model consists of a rectangular fluid reservoir, a vertical cavity and an inclined channel connecting the reservoir and cavity. This design is easy to construct and very effective in transporting and storing heat for space heating in winter. The concept employed in the second model could be further extended to build a solar water heating system with a tubeless flat plate collector. An antifreeze solution is circulated through the system by natural convection extracting heat from the solar energy to heat the water contained in a separate storage tank
Keywords :
natural convection; solar absorber-convertors; solar heating; space heating; thermal energy storage; antifreeze solution; heat storage; heat transfer direction; heat transport; inclined channel; natural convection; rectangular fluid reservoir; rectangular loops; solar energy utilisation; solar water heating system; space heating; thermal diode concept; tubeless flat plate collector; vertical cavity; winter; Diodes; Heat transfer; Numerical simulation; Reservoirs; Solar heating; Space heating; Sun; Testing; Water heating; Water storage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Energy Conversion Engineering Conference, 1996. IECEC 96., Proceedings of the 31st Intersociety
Conference_Location :
Washington, DC
ISSN :
1089-3547
Print_ISBN :
0-7803-3547-3
Type :
conf
DOI :
10.1109/IECEC.1996.553359
Filename :
553359
Link To Document :
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