Title :
Design of a Test Bench for
and HTS Wires
Author :
Statera, Marco ; Ciullo, Giuseppe ; Lenisa, Paolo ; Nardelli, Davide ; Piccardo, R. ; Barion, L. ; Bertelli, S. ; Contalbrigo, Marco ; Dalpiaz, P.F. ; Pappalardo, Luca
Author_Institution :
Univ. di Ferrara, Ferrara, Italy
Abstract :
An innovative test bench for high-temperature superconducting (HTS) cables has been designed and is presently under construction at the Cryogenic Laboratory of the University of Ferrara and INFN-Ferrara, Italy. The aim of the test bench is to measure the critical current as a function of tension or compression of a straight MgB2 and HTS wire at their working temperature. Currents up to 600 A will be supplied to a 120-mm-long wire, which can be cooled down to 20 K by cold-heads in vacuum. A piece of information from the traction bench will be synchronized with the power supply and quench protection system. Because the stress is constant on the wire cross-section, the measurement of the properties of a straight-wire represents a direct measurement of the strain behavior of the HTS wire. The full mechanical design will be illustrated together with the complete data acquisition system.
Keywords :
critical current density (superconductivity); cryogenics; data acquisition; high-temperature superconductors; magnesium compounds; power supplies to apparatus; superconducting cables; wires (electric); HTS cables; HTS wires; INFN-Ferrara; MgB2; University of Ferrara; cold-heads; compression; critical current; cryogenic laboratory; data acquisition system; direct measurement; high-temperature superconducting cables; mechanical design; power supply; quench protection system; strain behavior; tension; test bench; traction bench; wire cross-section; working temperature; Clamps; Current measurement; Heating; High temperature superconductors; Superconducting magnets; Temperature measurement; Wires; $hbox{MgB}_{2}$ wires; critical current measurement; high-temperature superconducting (HTS); test facility;
Journal_Title :
Applied Superconductivity, IEEE Transactions on
DOI :
10.1109/TASC.2013.2238988