Title :
Ultra short pulse laser meeting the requirements for high speed and high quality dicing of low-k wafers
Author :
Sillanpaa, J. ; Kangastupa, Jarno ; Salokatve, Arto ; Asonen, Harry
Author_Institution :
Corelase, Tampere
Abstract :
Commercially available sawing technologies don´t seem to be capable of meeting the challenging task of wafer dicing process. This paper presents a novel technology and procedure that eliminate the issues related to dicing of low-k wafers. Our tests demonstrate that Corelase´s ultra short pulse laser technology, X-LASE, can be used in conjunction with traditional diamond sawing to dice low-k wafers without chipping, delamination or cracking problems
Keywords :
integrated circuit manufacture; laser beam machining; sawing; X-LASE; diamond sawing; high quality dicing; high speed dicing; low-k wafers; sawing technologies; ultra short pulse laser technology; wafer dicing process; Adhesives; Blades; Delamination; Laser beam cutting; Laser beams; Optical materials; Optical pulses; Sawing; Semiconductor lasers; Semiconductor materials;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference and Workshop, 2005 IEEE/SEMI
Conference_Location :
Munich
Print_ISBN :
0-7803-8997-2
DOI :
10.1109/ASMC.2005.1438793
