DocumentCode
3322189
Title
Ultra short pulse laser meeting the requirements for high speed and high quality dicing of low-k wafers
Author
Sillanpaa, J. ; Kangastupa, Jarno ; Salokatve, Arto ; Asonen, Harry
Author_Institution
Corelase, Tampere
fYear
2005
fDate
11-12 April 2005
Firstpage
194
Lastpage
196
Abstract
Commercially available sawing technologies don´t seem to be capable of meeting the challenging task of wafer dicing process. This paper presents a novel technology and procedure that eliminate the issues related to dicing of low-k wafers. Our tests demonstrate that Corelase´s ultra short pulse laser technology, X-LASE, can be used in conjunction with traditional diamond sawing to dice low-k wafers without chipping, delamination or cracking problems
Keywords
integrated circuit manufacture; laser beam machining; sawing; X-LASE; diamond sawing; high quality dicing; high speed dicing; low-k wafers; sawing technologies; ultra short pulse laser technology; wafer dicing process; Adhesives; Blades; Delamination; Laser beam cutting; Laser beams; Optical materials; Optical pulses; Sawing; Semiconductor lasers; Semiconductor materials;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference and Workshop, 2005 IEEE/SEMI
Conference_Location
Munich
Print_ISBN
0-7803-8997-2
Type
conf
DOI
10.1109/ASMC.2005.1438793
Filename
1438793
Link To Document