Title :
Using TCAD for fast analysis of misprocessed wafers and yield excursions
Author :
Minixhofer, Rainer ; Rathei, Dieter
Author_Institution :
Austriamicrosystems AG
Abstract :
So far, TCAD simulation has been extensively used for process development, but its application for manufacturing control and corrective action was very limited. In this paper we show that TCAD can also be very beneficially used for identifying manufacturing accidents like missing or doubled implants without involving process integration or device physics experts
Keywords :
integrated circuit manufacture; manufacturing processes; production engineering computing; technology CAD (electronics); TCAD; corrective action; doubled implants; manufacturing accident identification; manufacturing control; misprocessed wafer analysis; missing implants; process development; yield excursion analysis; Accidents; Computational modeling; Data engineering; Fabrication; Implants; Manufacturing processes; Production; Semiconductor device testing; Semiconductor devices; Virtual manufacturing;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference and Workshop, 2005 IEEE/SEMI
Conference_Location :
Munich
Print_ISBN :
0-7803-8997-2
DOI :
10.1109/ASMC.2005.1438794
