Title :
Exploring new design architectures to reach time-to-market goals
Author :
Fujimura, Aki ; Joshi, Ketan
Author_Institution :
X Initiative, Mountain View, CA
Abstract :
This paper discusses how an open collaboration model and an innovative interconnect design are working in tandem to address key technical and manufacturing challenges, enabling chipmakers to achieve increasingly aggressive time-to-market goals
Keywords :
integrated circuit manufacture; time to market; chipmakers; design architectures; innovative interconnect design; manufacturing challenges; open collaboration model; time-to-market goals; Collaboration; Computer architecture; Delay effects; Integrated circuit interconnections; Integrated circuit yield; Semiconductor device manufacture; Supply chains; Time to market; Wires; Wiring;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference and Workshop, 2005 IEEE/SEMI
Conference_Location :
Munich
Print_ISBN :
0-7803-8997-2
DOI :
10.1109/ASMC.2005.1438802
