• DocumentCode
    332240
  • Title

    A review of Emotional Intelligence by Daniel Goleman: implications for technical education

  • Author

    Culver, D.

  • Author_Institution
    Watson Sch. of Eng. & Appl. Sci., State Univ. of New York, Binghamton, NY, USA
  • Volume
    2
  • fYear
    1998
  • fDate
    4-7 Nov. 1998
  • Firstpage
    855
  • Abstract
    Goleman\´s book, Emotional Intelligence, holds some valuable lessons as we attempt to design more effective educational programs. Goleman takes a more holistic approach to defining intelligence than the traditional IQ, which focuses on cognitive intelligence. By incorporating the cognitive and affective dimensions of intelligence, he demonstrates that, to be successful in life, it takes more than just being "smart". We are all aware of "smart" students who flunk out of college, or those who graduate near the top of their class only to be a failure in the work place. Goleman shows that the seeds of what he calls emotional intelligence are sown early in life, and affect not only how the person gets along with others, but also how they succeed in academic pursuits. In contrast to cognitive intelligence, which is "God given", emotional intelligence can be strengthened later in life with proper tutoring and commitment. Goleman\´s ideas are a valuable complement to the author\´s earlier studies of Perry\´s model of intellectual and ethical development in college students. This paper describes Goleman\´s hypotheses and suggests how they might impact technical education.
  • Keywords
    engineering education; Emotional Intelligence; Perry´s model; academic pursuits; cognitive intelligence; college students; effective educational programs design; ethical development; intellectual development; technical education; Bonding; Books; Design engineering; Educational institutions; Educational programs; Employment; Humans; Intelligent structures; Laboratories; Roads;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Frontiers in Education Conference, 1998. FIE '98. 28th Annual
  • Conference_Location
    Tempe, AZ, USA
  • ISSN
    0190-5848
  • Print_ISBN
    0-7803-4762-5
  • Type

    conf

  • DOI
    10.1109/FIE.1998.738818
  • Filename
    738818