DocumentCode :
3323724
Title :
High reliability non-hermetic 0.15 μm GaAs pseudomorphic HEMT MMIC amplifiers
Author :
Leung, D.L. ; Chou, Y.C. ; Wu, C.S. ; Kono, R. ; Scarpulla, J. ; Lai, R. ; Hoppe, M. ; Streit, D.C.
Author_Institution :
Electron. Syst. & Technol. Div., TRW Inc., Redondo Beach, CA, USA
fYear :
1999
fDate :
1999
Firstpage :
153
Lastpage :
156
Abstract :
High reliability performance of a Ka-band low-noise MMIC amplifier fabricated using a 0.15 μm production AlGaAs-InGaAs-GaAs HEMT process technology is reported. Operating at an accelerated DC bias condition of Vds=5.2 V and Ids=250 mA/mm, two-stage balanced amplifiers were lifetested at three-temperatures (Tambient=235°C, Tambient=250°C, and Tambient=265°C) in air ambient. Failure time for each temperature was determined using ΔS21=-1.0 dB measured at room temperature as the failure criteria. The activation energy (Ea) is 1.6 eV, achieving a projected median-time-to-failure (MTF) of 7×109 hours at a 125°C junction temperature. This is the first report of 0.15 μm HEMT reliability based on S21 failure criteria of MMIC amplifiers under DC stress at high junction temperature in air ambient. This result demonstrates a robust HEMT technology immune to the stress effects of high electric field under high temperature operation suitable for non-hermetic commercial Ka-band applications
Keywords :
HEMT integrated circuits; III-V semiconductors; MMIC amplifiers; failure analysis; field effect MMIC; gallium arsenide; integrated circuit noise; integrated circuit reliability; integrated circuit testing; life testing; 0.15 micron; 125 C; 235 to 265 C; 5.2 V; AlGaAs-InGaAs-GaAs; DC stress; HEMT reliability; Ka-band; MMIC LNA; PHEMT MMIC amplifiers; accelerated DC bias condition; air ambient; failure criteria; high junction temperature; high reliability; high temperature operation; low-noise MMIC amplifier; nonhermetic applications; pseudomorphic HEMT; two-stage balanced amplifiers; Acceleration; Gallium arsenide; HEMTs; Low-noise amplifiers; MMICs; PHEMTs; Production; Stress; Temperature measurement; Time measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Radio Frequency Integrated Circuits (RFIC) Symposium, 1999 IEEE
Conference_Location :
Anaheim, CA
ISSN :
1097-2633
Print_ISBN :
0-7803-5604-7
Type :
conf
DOI :
10.1109/RFIC.1999.805259
Filename :
805259
Link To Document :
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