DocumentCode :
3323893
Title :
EM simulation and experimental assessment of VPS process control module
Author :
Mihailescu, Bogdan ; Plotog, Ioan ; Svasta, Paul ; Vladescu, M.
Author_Institution :
Centre for Technol. Electron. & Interconnection Tech., Politeh. Univ. of Bucharest, Bucharest, Romania
fYear :
2010
fDate :
23-26 Sept. 2010
Firstpage :
233
Lastpage :
236
Abstract :
The Vapor Phase Soldering technology (VPS) requires accurate power control in order to obtain the optimum thermal profile for a reliable solder joint. In order to accomplish this, a programmable electronic module is used to obtain variable and controllable power injection during the Vapor Phase Soldering process (VPS) including the power-on and power-off phases. The module represents a proprietary solution to obtaining low conducted and especially low radiated emissions by detecting and switching the power semiconductor devices close the zero crossing of the mains voltage. The paper focuses on the modeling, the simulation and multiple experiments regarding electromagnetic compatibility (EMC) performance of the electronic module which follows the design for excellence (DFX) activities in case of new products development process. Using 3D modeling and simulation software the electromagnetic field effects of the VPS process control module considered as the EM source device are analyzed and compared with extensive EMC measurements taken in different laboratories. The results are then validated with the intent of completing the design methodology for manufacturing new products based on the works presented in the paper.
Keywords :
computational electromagnetics; electromagnetic compatibility; modules; power semiconductor devices; programmable circuits; soldering; 3D modeling; EM simulation; EMC; VPS process control module; electromagnetic compatibility; optimum thermal profile; power control; power semiconductor device; programmable electronic module; reliable solder joint; vapor phase soldering technology; variable power injection; Electromagnetic compatibility; Electromagnetics; Laboratories; Process control; Soldering; Solid modeling; Three dimensional displays; electromagnetic compatibility; electromagnetic radiation; modeling; simulation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design and Technology in Electronic Packaging (SIITME), 2010 IEEE 16th International Symposium for
Conference_Location :
Pitesti
Print_ISBN :
978-1-4244-8123-1
Type :
conf
DOI :
10.1109/SIITME.2010.5650919
Filename :
5650919
Link To Document :
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