DocumentCode :
3326063
Title :
Design of wideband LC balun embedded into organic substrate using coupled LC resonators
Author :
Park, Jong C. ; Park, Jae Y.
Author_Institution :
Dept. of Electron. Eng., Kwangwoon Univ., Seoul
fYear :
2007
fDate :
29-31 Dec. 2007
Firstpage :
85
Lastpage :
88
Abstract :
In this paper, wideband LC balun using coupled LC resonator has been designed, simulated and fabricated for being embedded into an organic packaging substrate. The proposed balun has a novel scheme which consists of two pair of coupled embedded LC resonators which share one resonator with each other. The coupled resonators are applied to obtain a precise phase difference of 180 degree and an identical magnitude between two balanced ports. This proposed balun has relatively small inductance and capacitance values which can be easily embedded into the organic packaging substrate. The capacitors at embedded LC resonators were realized by using high dielectric BTO composite film. The measured result shows that fabricated balun has excellent phase and magnitude imbalanced characteristic. The measured results are an insertion loss of 1.8 dB, a return loss of 10 dB, a phase imbalance of 0.5 degree and magnitude imbalance of 0.7 dB at frequency bandwidth of 700 MHz ranged from 1.8 GHz to 2.5 GHz, respectively. The fabricated balun has a volume of 2 mm x 3.5 mm x 0.66 mm (height). The measured result was well agreed with the simulated results.
Keywords :
UHF circuits; baluns; cavity resonators; composite materials; coupled circuits; dielectric thin films; electronics packaging; bandwidth 700 MHz; capacitors; coupled LC resonators; frequency 1.8 GHz to 2.5 GHz; high dielectric BTO composite film; loss 1.8 dB; loss 10 dB; organic packaging substrate; wideband LC balun; Capacitance; Capacitors; Dielectric loss measurement; Dielectric measurements; Dielectric substrates; Impedance matching; Inductance; Packaging; Phase measurement; Wideband; Coupled LC resonator; SOP; Wideband balun; capacitor; high dielectric composite; inductor; organic package substrate;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microelectronics, 2007. ICM 2007. Internatonal Conference on
Conference_Location :
Cairo
Print_ISBN :
978-1-4244-1846-6
Electronic_ISBN :
978-1-4244-1847-3
Type :
conf
DOI :
10.1109/ICM.2007.4497667
Filename :
4497667
Link To Document :
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