Title :
High frequency interconnections using electrically conductive adhesives
Author :
Dernevik, Markus ; Liu, Johan ; Starski, Piotr
Author_Institution :
Chalmers Univ. of Technol., Goteborg, Sweden
Abstract :
Results from measurements and simulation of high frequency interconnections are used to obtain an electrical model of the adhesive joint based on the physical parameters involved. Isotropically conductive adhesive joints can be used at microwave frequencies at least up to 30 GHz. Results indicate that the electrical performance of these connections is comparable to that of solder joints
Keywords :
adhesives; interconnections; microwave circuits; packaging; 0 to 30 GHz; adhesive joint; electrical model; electrical performance; electrically conductive adhesives; high frequency interconnections; isotropically conductive joints; microwave frequencies; physical parameters; Bonding; Calibration; Circuit testing; Conductive adhesives; Copper; Frequency; Integrated circuit interconnections; Microstrip; Semiconductor device measurement; Silicon;
Conference_Titel :
Microwaves and Radar, 1998. MIKON '98., 12th International Conference on
Conference_Location :
Krakow
Print_ISBN :
83-906662-0-0
DOI :
10.1109/MIKON.1998.742803
