Performance and modeling of bonding wire transformers in a package for RF IC´s

The experimental investigation of the inductances and coupling factors of bonding wire transformers on packages is presented in this paper. The impact of the length and spacing between the bonding wires on these parameters is carefully examined, while taking into account the self and mutual inductances of the package. The experimental results show that bonding wire transformers can achieve coupling coefficients between 0.3 and 0.5. A wide range of transformer inductances can be achieved by manipulating the lengths of the bonding wires. When carefully co-designed with an RF system, these transformers can improve its efficiency, reliability, and performance.