Title :
Fabrication and Assembly of Cu-RDL-Based 2.5-D Low-Cost Through Silicon Interposer (LC–TSI)
Author :
Katti, Guruprasad ; Ho, S.W. ; Li Hong Yu ; Songbai Zhang ; Dutta, Rahul ; Weerasekera, Roshan ; Ka Fai Chang ; Jong-Kai Lin ; Vempati, Srinivasa Rao ; Bhattacharya, Surya
Abstract :
Editor´s notes: Two-and-a-half-dimensional integration enables high-density interdie connections with low cost. This paper presents a through silicon interposer (TSI) fabrication process and detailed characterization and measurement results of redistribution layers and through silicon vias for low-cost 2.5-D integration.
Keywords :
integrated circuit packaging; three-dimensional integrated circuits; high-density interdie connections; low-cost through silicon interposer; redistribution layers; CADCAM; Circuit synthesis; Dielectrics; Fabrication; Integrated circuit manufacture; Microelectronics; Polymers; Low cost Through-Silicon Interposer (TSI); polymer based Cu-RDL technology;
Journal_Title :
Design & Test, IEEE
DOI :
10.1109/MDAT.2015.2424429
