• DocumentCode
    332705
  • Title

    Slicing floorplans with pre-placed modules

  • Author

    Young, F.Y. ; Wong, D.F.

  • Author_Institution
    Dept. of Comput. Sci., Texas Univ., Austin, TX, USA
  • fYear
    1998
  • fDate
    8-12 Nov. 1998
  • Firstpage
    252
  • Lastpage
    258
  • Abstract
    Existing floorplanners that use slicing floorplans are efficient in runtime and yet can pack modules tightly. However, none of them can handle pre-placed modules. In this paper, we extend a well-known slicing floorplanner to handle pre-placed modules. Our main contribution is a novel shape curve computation procedure which can take the positions of the pre-placed modules into consideration. The shape curve computation procedure is used repeatedly during the floorplanning process to fully exploit the shape flexibility of the modules to give a tight packing. Experimental results show that the extended floorplanner performs very well.
  • Keywords
    VLSI; circuit layout CAD; integrated circuit layout; modules; pre-placed module position; pre-placed modules; shape curve computation procedure; shape flexibility; slicing floorplans; tight module packing; Art; Benchmark testing; Costs; Design methodology; Integrated circuit interconnections; Permission; Runtime; Shape; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer-Aided Design, 1998. ICCAD 98. Digest of Technical Papers. 1998 IEEE/ACM International Conference on
  • Conference_Location
    San Jose, CA, USA
  • Print_ISBN
    1-58113-008-2
  • Type

    conf

  • DOI
    10.1109/ICCAD.1998.144275
  • Filename
    742881