DocumentCode
332705
Title
Slicing floorplans with pre-placed modules
Author
Young, F.Y. ; Wong, D.F.
Author_Institution
Dept. of Comput. Sci., Texas Univ., Austin, TX, USA
fYear
1998
fDate
8-12 Nov. 1998
Firstpage
252
Lastpage
258
Abstract
Existing floorplanners that use slicing floorplans are efficient in runtime and yet can pack modules tightly. However, none of them can handle pre-placed modules. In this paper, we extend a well-known slicing floorplanner to handle pre-placed modules. Our main contribution is a novel shape curve computation procedure which can take the positions of the pre-placed modules into consideration. The shape curve computation procedure is used repeatedly during the floorplanning process to fully exploit the shape flexibility of the modules to give a tight packing. Experimental results show that the extended floorplanner performs very well.
Keywords
VLSI; circuit layout CAD; integrated circuit layout; modules; pre-placed module position; pre-placed modules; shape curve computation procedure; shape flexibility; slicing floorplans; tight module packing; Art; Benchmark testing; Costs; Design methodology; Integrated circuit interconnections; Permission; Runtime; Shape; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer-Aided Design, 1998. ICCAD 98. Digest of Technical Papers. 1998 IEEE/ACM International Conference on
Conference_Location
San Jose, CA, USA
Print_ISBN
1-58113-008-2
Type
conf
DOI
10.1109/ICCAD.1998.144275
Filename
742881
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