• DocumentCode
    332707
  • Title

    The multi-BSG: stochastic approach to an optimum packing of convex-rectilinear blocks

  • Author

    Sakanushi, K. ; Nakatake, S. ; Kajitani, Y.

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Tokyo Inst. of Technol., Japan
  • fYear
    1998
  • fDate
    8-12 Nov. 1998
  • Firstpage
    267
  • Lastpage
    274
  • Abstract
    A floorplanner that can handle convex-rectilinear blocks is developed by enhancing the BSG-based packing algorithm. The ideas are in the introduction of (1) multi-rectangle representation of a block as a superpose of element-rectangles, (2) parametric-BSG as a generalization of the BSG, (3) multi-BSG which is an arrangement of plural BSG´s on a multi-layer, and (4) layer sharing condition of element-rectangles so that non-overlapping is discussed on each layer. A solution space of packings is defined as the set of packings generated by changing parametric-BSG and room assignments. It is guaranteed to contain an optimal packing if the BSG is not smaller than a certain size. A floorplan based on a simulated annealing was implemented. In experiments, it output highly compressed packings.
  • Keywords
    algorithm theory; bin packing; circuit layout CAD; circuit optimisation; integrated circuit layout; simulated annealing; stochastic processes; BSG-based packing algorithm; convex-rectilinear block handling; element rectangles; floorplanner; highly compressed packings; layer sharing condition; multi-BSG; multi-rectangle representation; multilayer; nonoverlapping; optimal packing; parametric-BSG; plural BSGs; room assignments; simulated annealing; solution space; stochastic approach; Brain modeling; Electroencephalography; Electron microscopy; Electronic circuits; Electronic mail; Large-scale systems; Permission; Semiconductor device manufacture; Simulated annealing; Stochastic processes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer-Aided Design, 1998. ICCAD 98. Digest of Technical Papers. 1998 IEEE/ACM International Conference on
  • Conference_Location
    San Jose, CA, USA
  • Print_ISBN
    1-58113-008-2
  • Type

    conf

  • DOI
    10.1109/ICCAD.1998.144277
  • Filename
    742883